What makes it unique?
There are various PUF technologies, but most of them are implemented using active devices, which are sensitive to PVT (process, voltage, temperature) changes, and are also prone to aging. To overcome this, an ECC (Error Correction Code) logic function must be additionally introduced.
However, VIA PUF is a technology that implements PUF by using the process deviation that occurs minutely when forming the via hole connecting the metal layers during the semiconductor production process.
This is a passive device method that is different from the existing active device method. It is an innovative method that solves all the problems of existing technologies.
Although it is made with the same design in the same process of semiconductor production, each semiconductor chip has different characteristics because it uses fine tolerances.
That is, different IDs are generated for each semiconductor chip.
This is also called the fingerprint of the semiconductor.
