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2016 PUF Mass-Produce & SaleThe SEMICON magazine, December of 2016

그동안의 반도체 시장은 반도체회로 축소화기술을 중심으로 한 미세화에 집중하는 한편, 집적 밀도를 향상시키기 위해 노력해 왔다. 그러나 최근의 반도체 시장은 고성능화뿐 아니라 제조 코스트 절감이라는 과제를 안고 있으며, 이에 업계는 반도체생산 설비의 초기 투자를 대규모화하여 대량생산을 통한 제조 코스트 절감에 나서고 있다. 제조현장에서의 로봇은 더 이상 선택사항이 아니다.

반도체 산업동향

- 11월 수출, 반도체 호조로 3개월 만에 반등 

- 10월 북미반도체장비산업 BB율 0.91, 반도체 총장비 출하액 증가 불구 수주액 감소 

- 실리콘 웨이퍼 2016년 3분기, 최고 매출 기록 경신

- 삼성전자 모바일 DRAM 시장 점유율 역대 최고 기록 

- DRAM 가격 강세 지속 전망 


Semiconductor NEWS 

 - Top 4 trends impacting semiconductor inspection system market from 2016-2020 

- Semiconductor sales will mark 0.8% growth in 2016 

- Semiconductor IP market will exceed $8 billion by 2020 

- Grenoble team demonstrates world’s first qubit device fabricated in standard CMOS process 

- Lab4MEMS project wins European nanoelectronics innovation award 

- UMC's Chinese joint venture launches operation of 12-inch wafer fab

- China has another semiconductor player, Ningbo Semiconductor International 

- SMIC and IMECAS sign cooperation agreement for MEMS R&D and foundry platform 


Business NEWS  

- 삼익THK, ‘2016 대구국제기계산업대전’에 참가해 다양한 신제품 선봬

- 로봇산업통한 제조혁신, 대구에서 시작된다 

- 현대중공업, 로봇사업부 분사 추진 

- 야스카와전기, 지속적인 고속 성장에 눈길 


Market Trend  

‘더 얇고 더 가볍게’ 반도체 패키지 기술 특허출원 증가시스템 반도체 분야 연구개발 강화해야 


Cover Story 

반도체산업의 로봇 테크놀로지


 

To read more:

https://blog.naver.com/control_i/220885694312








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We do these things.
PUF Technology



What is PUF?

Unique Inborn ID 
(PUF, Physically Unclonable Functions)

•Silicon Inborn ID using the randomness of passive device generation in the semiconductor manufacturing process

• As a Physical ID created with physical characteristics, it is fundamentally impossible to falsify or duplicate the value

• Since each semiconductor chip generates a different unique ID, it is called a semiconductor fingerprint.

PUF Advantages

AS Via PUF provides unique Silicon Inborn ID characteristics,  It provides the Root of Trust (RoT), the source of all trust

•Via PUF guarantees stability that is impervious to 
various types of hacking attacks.

•Via PUF is a method of forming via holes between 
metal layers during semiconductor processing.

•As a passive device method, it is an innovative method
that solves all the problems of existing technologies.

•PUF that satisfies all randomness, homeostasis and 
security •Unlike other technologies, no error correction
circuit (ECC) is required.

What you can do with PUF

VIA PUF can be applied to various IoT devices and solutions  that require strong security.

•ICTK's security chip generates a key pair of a private key and a public key in the security chip using an algorithm called ECC based on the key generated by PUF.

•ICTK's PUF security chip provides encrypted RAM (Random Access Memory) and encrypted eFlash (flash memory) inside.

•ICTK's security chip can be operated in PQC (Post Quantum Cryptography), a quantum security algorithm.

ICTK's security chip is the most powerful existing method to provide the Root of Trust function based on PUF.

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