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2013 The Encounter with HY univ.Visa Mobile Proximity Payment Testing & Compliance

Source: Micropross

Micropross is proud to announce that ICTK, the leading test laboratory dedicated to the smartcard industry, successfully passed the audit process from EMVCo aiming at enabling them to deliver certification of contactless devices following the EMVCo Level 1 analog specifications.

This huge achievement was made using the Micropross EMVCo validated Level 1 test bench.

Sangseon Park, Director of the Technical Convergence Department said : "We have been working with Micropross test equipment for more than 10 years until now, for other contact and contactless projects. The performance of their tools, as well as their support has always been outstanding. It was therefore natural that we continued the collaboration for our EMVCoL1 contactless analog project, especially given the highly automated nature of their test tool and the possibility to upgrade it easily to support NFC Forum test specification".

Indeed, the Micropross automated EMVCo L1 PICC analog test tool is part of the Contactless Test Station, a revolutionary concept concentrating in one box which contains all elements necessary to perform ISO 10373-6, ISO 10373-7, ICAO, EMVCo, and NFC Forum analog, digital and applicative tests. This unique tool therefore satisfies the customer's needs. Micropross is the only test tool provider on the market with such a wide coverage, so many validated solutions (EMVCo, NFC Forum, ICAO) and with the ability to provide all hardware and software elements from the same source.

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We do these things.
PUF Technology

What is PUF?

Unique Inborn ID 
(PUF, Physically Unclonable Functions)

•Silicon Inborn ID using the randomness of passive device generation in the semiconductor manufacturing process

• As a Physical ID created with physical characteristics, it is fundamentally impossible to falsify or duplicate the value

• Since each semiconductor chip generates a different unique ID, it is called a semiconductor fingerprint.

PUF Advantages

AS Via PUF provides unique Silicon Inborn ID characteristics,  It provides the Root of Trust (RoT), the source of all trust

•Via PUF guarantees stability that is impervious to 
various types of hacking attacks.

•Via PUF is a method of forming via holes between 
metal layers during semiconductor processing.

•As a passive device method, it is an innovative method
that solves all the problems of existing technologies.

•PUF that satisfies all randomness, homeostasis and 
security •Unlike other technologies, no error correction
circuit (ECC) is required.

What you can do with PUF

VIA PUF can be applied to various IoT devices and solutions  that require strong security.

•ICTK's security chip generates a key pair of a private key and a public key in the security chip using an algorithm called ECC based on the key generated by PUF.

•ICTK's PUF security chip provides encrypted RAM (Random Access Memory) and encrypted eFlash (flash memory) inside.

•ICTK's security chip can be operated in PQC (Post Quantum Cryptography), a quantum security algorithm.

ICTK's security chip is the most powerful existing method to provide the Root of Trust function based on PUF.