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2023 1st steps towards IPOChip IP giant Rambus joins forces with security firm ICTK, extending trust in semiconductors

Rambus, a leading American semiconductor company known for its expertise in silicon intellectual property (IP) and chip solutions, has recently signed a Memorandum of Understanding (MOU) with South Korea’s ICTK Holdings. This strategic collaboration aims to leverage physically unclonable function (PUF) technology, a cutting-edge security solution that has the potential to revolutionize the industry.

ICTK Holdings specializes in a range of security solutions based on PUF technology, including IP, chip, module, device, and platform technologies. These solutions are designed to provide enhanced security and protection for various applications in the ever-evolving digital landscape.

The company’s VIA PUF technology, which uses the random formation of via holes in semiconductor manufacturing process, stands out among other PUF technologies, offering superior steadiness and reliability. This is particularly noteworthy when compared to competing SRAM PUF technology, which faces potential concerns and limitations in under sub-10 nanometer processes. As a result, the future applications of SRAM PUF technology may be restricted.

Recognizing the immense potential of VIA PUF technology, Rambus has strategically entered into the MOU with ICTK Holdings. This collaboration comes at a time when South Korea’s global market share in System-on-Chip (SoC) is currently less than 1%. In light of this, the success of promising SoC fabless companies, like ICTK Holdings, is garnering significant attention in the industry.

The South Korean government is expected to shift its investment focus from memory semiconductors to non-memory SoC fields, aligning with the potential of emerging technologies like VIA PUF. Justin Lee, the CEO of ICTK Holdings is confident that this trend offers a valuable opportunity for their homegrown technology to expand overseas and contribute to the advancement of security solutions.

“With the backing of the South Korean government and the strategic collaboration with Rambus, ICTK Holdings is well-positioned to capitalize on the growing interest in PUF technology and strengthen its foothold in the global market,” said Lee.

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We do these things.
PUF Technology

What is PUF?

Unique Inborn ID 
(PUF, Physically Unclonable Functions)

•Silicon Inborn ID using the randomness of passive device generation in the semiconductor manufacturing process

• As a Physical ID created with physical characteristics, it is fundamentally impossible to falsify or duplicate the value

• Since each semiconductor chip generates a different unique ID, it is called a semiconductor fingerprint.

PUF Advantages

AS Via PUF provides unique Silicon Inborn ID characteristics,  It provides the Root of Trust (RoT), the source of all trust

•Via PUF guarantees stability that is impervious to 
various types of hacking attacks.

•Via PUF is a method of forming via holes between 
metal layers during semiconductor processing.

•As a passive device method, it is an innovative method
that solves all the problems of existing technologies.

•PUF that satisfies all randomness, homeostasis and 
security •Unlike other technologies, no error correction
circuit (ECC) is required.

What you can do with PUF

VIA PUF can be applied to various IoT devices and solutions  that require strong security.

•ICTK's security chip generates a key pair of a private key and a public key in the security chip using an algorithm called ECC based on the key generated by PUF.

•ICTK's PUF security chip provides encrypted RAM (Random Access Memory) and encrypted eFlash (flash memory) inside.

•ICTK's security chip can be operated in PQC (Post Quantum Cryptography), a quantum security algorithm.

ICTK's security chip is the most powerful existing method to provide the Root of Trust function based on PUF.