AS Via PUF provides unique Silicon Inborn ID characteristics, It provides the Root of Trust (RoT), the source of all trust
•Via PUF guarantees stability that is impervious to
various types of hacking attacks.
•Via PUF is a method of forming via holes between
metal layers during semiconductor processing.
•As a passive device method, it is an innovative method
that solves all the problems of existing technologies.
•PUF that satisfies all randomness, homeostasis and
security •Unlike other technologies, no error correction
circuit (ECC) is required.
The 1st step win-win IP with KEPCO!
To read more: