AS Via PUF provides unique Silicon Inborn ID characteristics, It provides the Root of Trust (RoT), the source of all trust
•Via PUF guarantees stability that is impervious to
various types of hacking attacks.
•Via PUF is a method of forming via holes between
metal layers during semiconductor processing.
•As a passive device method, it is an innovative method
that solves all the problems of existing technologies.
•PUF that satisfies all randomness, homeostasis and
security •Unlike other technologies, no error correction
circuit (ECC) is required.
This white paper is the result of a collaborations between Menta SAS, RKVST, Imagination Technologies, Intel, Device Authority, Secure-IC, Crypto Quantique, Intrinsic ID and ICTK Holdings in GSA group activity.
The document is targeting all the actors along the semiconductor and device supply chains. It is also targeting the organizations that will consume these devices, especially within the IoT industry. The document is written for the executives, the product managers and the senior architects of these companies. Its objective is to expose that IoT data reporting and management systems need to be built around end to end architectures that integrate Identity and security as fundamental building blocks. To create value chains that take advantage of competition, cooperation between all the suppliers around the identity and security models is fundamental. Ideally, the systems used standardized design concepts to enable the consistent tracking of all the building blocks.
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